HMK325B7684KN_技术文档

Notice for TAIYO YUDEN productsꢀ

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2010. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-

fore practical application or usage of the Products.

Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-

rating such products, which are caused under the conditions other than those speciﬁed in this catalog or individual

speciﬁcation.

■ Please contact Taiyo Yuden Co., Ltd. for further details of product speciﬁcations as the individual speciﬁcation is

available.

■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment

before commercial shipment of the equipment.

■ All electronic components or functional modules listed in this catalog are developed, designed and intended for

use in general electronics equipment.(for AV, office automation, household, office supply, information service,

telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any

equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal,

disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have

direct inﬂuence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.

Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma-

rine system, military, etc. where higher safety and reliability are especially required.

In addition, even electronic components or functional modules that are used for the general electronic equipment,

if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil-

ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to

install a protective circuit is strongly recommended at customer's design stage.

■ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu-

tors (so called“TAIYO YUDEN’s ofﬁcial sales channel”).

It is only applicable to the products purchased from any of TAIYO YUDEN’s ofﬁcial sales channel.

■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-

cur in connection with a third party's intellectual property rights and other related rights arising from your usage of

products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.

■ Caution for export

Certain items in this catalog may require speciﬁc procedures for export according to“Foreign Exchange and For-

eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.

Should you have any question or inquiry on this matter, please contact our sales staff.

notice_e-01

MEDIUM-HIGH VOLTAGE MULTILAYER CERAMIC CAPACITORS

REFLOW

■ FEATURES

■ APPLICATIONS

◦ꢀThe use of nickel as electrode material prevents migration and pro-

◦Gꢀ eneral telephone exchange

◦Iꢀnverter

vides high reliability.

◦ꢀSmall case sizes with high rated voltage.

◦Wꢀ ireless and Telecommunication base

◦Fꢀ or DC/DC Converter

■ PART NUMBER

H M K 3 1 6 △ B J 1 0 4 K L － T △

❶

❷

❸

❹

❺

❻

❼

❽

❾

❿

⓫

⓬

❻Temperature

❹Dimension

⓬Internal code

Standard

△＝Blank space

❾Thickness

〔mm〕

❿Special code

❶Rated

❽Special code

❸End

characteristics code

voltage〔VDC〕

Type （inch） L×W［mm］

107 （0603） 1.6×0.8

212 （0805） 2.0×1.25

316 （1206） 3.2×1.6

325 （1210） 3.2×2.5

432 （1812） 4.5×3.2

termination

Plated

△

－

Standard

K

±10%

±20%

B

X5R

BJ

A

0.8

0.85

1.25

1.15

1.6

H

Q

S

100

250

630

K

M

D

G

F

C7

B7

X7S

X7R

⓫Packaging

❷Series name

Multilayer ceramic

capacitor

φ178mm Taping

（4mm pitch）

T

❼Nominal

capacitance〔pF〕

M

❺Dimension

tolerance

L

N

M

1.9

example

104

105

△

Standard

2.5

100,000

△＝Blank space

1,000,000

■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY

Dimension [mm]

Standard quantity [pcs]

Paper tape Embossed tape

Type

L

W

T

e

□MK107

1.6±0.10

0.8±0.10

1.25±0.10

1.6±0.15

2.5±0.20

3.2±0.30

0.8±0.10

A

0.35±0.25

0.5±0.25

4000

－

（0603 inch）

0.85±0.10

1.25±0.10

1.15±0.10

1.6±0.20

1.15±0.10

1.9±0.20

D

G

F

4000

－

□MK212

（0805 inch）

2.0±0.10

3.2±0.15

3.2±0.3

4.5±0.4

－

3000

2000

□MK316

（1206 inch）

0.5 ＋0.35/ー0.25

0.6±0.3

－

L

F

□MK325

（1210 inch）

2000

500

N

□MK432

（1812 inch）

2.5±0.20

M

0.9±0.6

■ AVAILABLE CAPACITANCE RANGE

107

212

316

325

432

Type

X7R X7S B/X5R

X7R

B/X5R

X7R

B/X5R

X7R

B/X5R

X7R

B/X5R

Cap

[μF]

VDC

[3-digit]

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

100 100 100 100 250 100 250 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630

0.001

0.0015

0.0022

0.0033

0.0047

0.0068

0.01

0.015

0.022

0.033

0.047

0.068

0.1

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

A

D

G

D

G

F

L

F

L

G

N

L

N

M

A

F

N

F

N

M

G

M

684

105

155

225

L

M

N

※Letters in the table indicate thickness.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

26

■ AVAILABLE CAPACITANCE RANGE

Temperature characteristics

Temperature range〔℃〕

－25～＋85

Capacitance tolerance

Temp.char.Code

〔％〕

Applicable standard

Ref. Temp〔. ℃〕

Capacitance chang〔e ％〕

JIS

B

20

25

±10

±15

±22

±15

BJ

EIA

X5R

X7S

X7R

－55～＋85

－55～＋125

±10（K）

±20（M）

C7

B7

EIA

■ REPRESENTATIVE PART NUMBERS

●107TYPE

【Temperature Characteristic BJ:B/X5R】

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK107 BJ102□A

HMK107 BJ152□A

HMK107 BJ222□A

HMK107 BJ332□A

HMK107 BJ472□A

HMK107 BJ682□A

HMK107 BJ103□A

HMK107 BJ153□A

HMK107 BJ223□A

HMK107 BJ333□A

HMK107 BJ104□A

B/X5R*¹

1000

1500

±10, ±20

3.5

0.8±0.1

R

200%

2200

3300

4700

6800

10000

15000

22000

33000

100000

Capacitance tolerance code is applied to □ of part number.

*1ꢁWe may provide X7R for some itemes according to the individual speciﬁcation.

【Temperature CharacteristicꢁB7：X7R, C7：X7S】

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK107 B7102□A

HMK107 B7152□A

HMK107 B7222□A

HMK107 B7332□A

HMK107 B7472□A

HMK107 B7682□A

HMK107 B7103□A

HMK107 B7153□A

HMK107 B7223□A

HMK107 B7333□A

HMK107 C7104□A

X7R

X7S

1000

1500

±10, ±20

3.5

0.8±0.1

R

200%

2200

3300

4700

6800

10000

15000

22000

33000

100000

Capacitance tolerance code is applied to □ of part number.

●212TYPE

【Temperature CharacteristicꢁBJ：B/X5R】

・1.25mm thicknes（s G）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK212 BJ103□G

HMK212 BJ153□G

HMK212 BJ223□G

HMK212 BJ333□G

HMK212 BJ473□G

HMK212 BJ683□G

HMK212 BJ104□G

HMK212 BJ224□G

QMK212 BJ472□G

QMK212 BJ682□G

QMK212 BJ103□G

QMK212 BJ153□G

QMK212 BJ223□G

B/X5R*¹

10000

15000

22000

33000

47000

68000

100000

220000

4700

±10, ±20

3.5

2.5

1.25±0.1

R

200%

150%

250V

6800

10000

15000

22000

・0.85mm thicknes（s D）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

250V

QMK212 BJ102□D

QMK212 BJ152□D

QMK212 BJ222□D

QMK212 BJ332□D

B/X5R*¹

1000

1500

2200

3300

±10, ±20

2.5

0.85±0.1

R

150%

Capacitance tolerance code is applied to □ of part number.

*1ꢁWe may provide X7R for some itemes according to the individual speciﬁcation.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

27

■ REPRESENTATIVE PART NUMBERS

【Temperature CharacteristicꢁB7：X7R】

・1.25mm thicknes（s G）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK212 B7103□G

HMK212 B7153□G

HMK212 B7223□G

HMK212 B7333□G

HMK212 B7473□G

HMK212 B7683□G

HMK212 B7104□G

HMK212 B7224□G

QMK212 B7472□G

QMK212 B7682□G

QMK212 B7103□G

QMK212 B7153□G

QMK212 B7223□G

X7R

10000

15000

22000

33000

47000

68000

100000

220000

4700

±10, ±20

3.5

2.5

1.25±0.1

R

200%

150%

250V

6800

10000

15000

22000

・0.85mm thicknes（s D）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

250V

QMK212 B7102□D

QMK212 B7152□D

QMK212 B7222□D

QMK212 B7332□D

X7R

1000

1500

2200

3300

±10, ±20

2.5

0.85±0.1

R

150%

Capacitance tolerance code is applied to □ of part number.

●316TYPE

【Temperature CharacteristicꢁBJ：B/X5R】

・1.6mm thicknes（s L）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK316 BJ473□L

HMK316 BJ683□L

HMK316 BJ104□L

HMK316 BJ154□L

HMK316 BJ224□L

HMK316 BJ334□L

HMK316 BJ474□L

HMK316 BJ105□L

QMK316 BJ333□L

QMK316 BJ473□L

QMK316 BJ683□L

QMK316 BJ104□L

SMK316 BJ153□L

SMK316 BJ223□L

B/X5R*¹

47000

68000

±10, ±20

3.5

2.5

1.6±0.2

R

200%

150%

120%

100000

150000

220000

330000

470000

1000000

33000

250V

630V

47000

68000

100000

15000

22000

・1.15mm thicknes（s F）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

630V

SMK316 BJ102□F

SMK316 BJ152□F

SMK316 BJ222□F

SMK316 BJ332□F

SMK316 BJ472□F

SMK316 BJ682□F

SMK316 BJ103□F

B/X5R*¹

1000

1500

2200

3300

4700

6800

10000

±10, ±20

2.5

1.15±0.1

R

120%

Capacitance tolerance code is applied to □ of part number.

*1ꢁWe may provide X7R for some itemes according to the individual speciﬁcation.

【Temperature CharacteristicꢁB7：X7R】

・1.6mm thicknes（s L）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK316 B7473□L

HMK316 B7683□L

HMK316 B7104□L

HMK316 B7154□L

HMK316 B7224□L

HMK316 B7334□L

HMK316 B7474□L

HMK316 B7105□L

QMK316 B7333□L

QMK316 B7473□L

QMK316 B7683□L

QMK316 B7104□L

SMK316 B7153□L

SMK316 B7223□L

X7R

47000

68000

±10, ±20

3.5

2.5

1.6±0.2

R

200%

150%

120%

100000

150000

220000

330000

470000

1000000

33000

250V

630V

47000

68000

100000

15000

22000

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

28

■ REPRESENTATIVE PART NUMBERS

・1.15mm thicknes（s F）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

630V

SMK316 B7102□F

SMK316 B7152□F

SMK316 B7222□F

SMK316 B7332□F

SMK316 B7472□F

SMK316 B7682□F

SMK316 B7103□F

X7R

1000

1500

2200

3300

4700

6800

10000

±10, ±20

2.5

1.15±0.1

R

120%

Capacitance tolerance code is applied to □ of part number.

●325TYPE

【Temperature CharacteristicꢁBJ：B/X5R】

・1.9mm thicknes（s N）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK325 BJ154□N

HMK325 BJ224□N

HMK325 BJ334□N

HMK325 BJ474□N

HMK325 BJ684□N

HMK325 BJ105□N

HMK325 BJ225□N

QMK325 BJ473□N

QMK325 BJ104□N

QMK325 BJ154□N

QMK325 BJ224□N

SMK325 BJ223□N

SMK325 BJ333□N

SMK325 BJ473□N

B/X5R*¹

150000

220000

330000

470000

680000

1000000

2200000

47000

±10, ±20

3.5

2.5

1.9±0.2

R

200%

150%

120%

250V

630V

100000

150000

220000

22000

33000

47000

・1.15mm thicknes（s F）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

Thickness

〔mm〕

Part number 1

HMK325 BJ104□F

Part number 2

Note

% Rated

voltage

〔%〕

100V

B/X5R*¹

100000

±10, ±20

3.5

1.15±0.1

R

200%

Capacitance tolerance code is applied to □ of part number.

*1ꢁWe may provide X7R for some itemes according to the individual speciﬁcation.

【Temperature CharacteristicꢁB7：X7R】

・1.9mm thicknes（s N）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK325 B7154□N

HMK325 B7224□N

HMK325 B7334□N

HMK325 B7474□N

HMK325 B7684□N

HMK325 B7105□N

HMK325 B7225□N

QMK325 B7473□N

QMK325 B7104□N

QMK325 B7154□N

QMK325 B7224□N

SMK325 B7223□N

SMK325 B7333□N

SMK325 B7473□N

X7R

150000

220000

330000

470000

680000

1000000

2200000

47000

±10, ±20

3.5

2.5

1.9±0.2

R

200%

150%

120%

250V

630V

100000

150000

220000

22000

33000

47000

・1.15mm thicknes（s F）

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK325 B7104□F

X7R

100000

±10, ±20

3.5

1.15±0.1

R

200%

Capacitance tolerance code is applied to □ of part number.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

29

■ REPRESENTATIVE PART NUMBERS

●432TYPE

【Temperature CharacteristicꢁBJ：B/X5R】

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

HMK432 BJ474□M

HMK432 BJ105□M

HMK432 BJ155□M

HMK432 BJ225□M

QMK432 BJ104□M

QMK432 BJ224□M

QMK432 BJ334□M

QMK432 BJ474□M

SMK432 BJ473□M

SMK432 BJ683□M

SMK432 BJ104□M

B/X5R*¹

470000

1000000

1500000

2200000

100000

220000

330000

470000

47000

±10, ±20

3.5

2.5

2.5±0.2

R

200%

150%

120%

250V

630V

68000

100000

Capacitance tolerance code is applied to □ of part number.

*1ꢁWe may provide X7R for some itemes according to the individual speciﬁcation.

【Temperature CharacteristicꢁB7：X7R】

HALT

Capacitance

tolerance

〔%〕

Soldering

R:Reﬂow

W:Wave

Internal

code

（P/N 1）

Rated

voltage

Temp.

char.

Capacitance

〔pF〕

tanδ

〔%〕

Thickness

〔mm〕

Part number 1

Part number 2

Note

% Rated

voltage

100V

250V

630V

HMK432 B7474□M

HMK432 B7105□M

HMK432 B7155□M

HMK432 B7225□M

QMK432 B7104□M

QMK432 B7224□M

QMK432 B7334□M

QMK432 B7474□M

SMK432 B7473□M

SMK432 B7683□M

SMK432 B7104□M

X7R

470000

1000000

1500000

2200000

100000

220000

330000

470000

47000

±10, ±20

3.5

2.5

2.5±0.2

R

200%

150%

120%

68000

100000

Capacitance tolerance code is applied to □ of part number.

■ ELECTRICAL CHARACTERISTICS

●Example of Impedance ESR vs. Frequency characteristics

Taiyo Yuden medium-high voltage ceramic capacitor

■

HMK212 BJ104KG / HMK212 B7104KG

SMK316 BJ223KL / SMK316 B7223KL

QMK325 BJ224KN / QMK325 B7224KN

HMK325 BJ105KN / HMK325 B7105KN

SMK432 BJ104KM / SMK432 B7104KM

QMK432 BJ474KM / QMK432 B7474KM

●Temperature characteristics

HMK325 BJ105KN / HMK325 B7105KN

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

30

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_e-01

31

■ PACKAGING

①Minimum Quantity

◦Taped package

③Representative taping dimensions

ꢁ◦Paper Tape（8mm wide）

ꢁ◦Pressed carrier tape（2mm pitch）

Thickness

mm

Standard quantity [pcs]

Type

Embossed

㧗0.1/−0

code

Paper tape

tape

□

MK042

0.2

0.3

C

P,T

P

—

15000

40000

□MK063

0.3

□2K096

0.45

0.3

K

10000

P

□WK105

0.5

V

—

T1

0.2

C

P

20000

15000

□MK105

□VK105

0.3

0.5

V, W

W

K

Unit：mm

10000

0.5

Chip Cavity

Insertion Pitch

Tape Thickness

Type

0.45

0.5

4000

Ａ

Ｂ

Ｆ

Ｔ

T1

□MK107

□WK107

V

—

4000

□MK063

□WK105

0.37

0.67

0.45max.

0.42max.

2.0±0.05

0.8

A

0.65

1.15

0.45max.

0.5

V

□2K110

0.6

B

4000

—

0.8

A

◦Punched carrier tape（2mm pitch）

0.45

0.85

1.25

0.85

1.15

1.25

1.6

K

□MK212

□WK212

D

㧗0.1/−0

G

D

—

3000

□4K212

□2K212

D

4000

—

D

F

□MK316

3000

2000

G

L

—

0.85

1.15

1.9

D

Unit：mm

F

Chip Cavity

Type

Insertion Pitch

Tape Thickness

T

□MK325

N

Y

—

A

B

F

2.0max

2.5

0.45max.

0.6max.

M

500（T）, 1000（P）

□2K096

0.72

1.02

□MK432

2.5

500

52.0±0.05

□MK105

□VK105

0.65

1.15

0.8max.

②Taping material

※No bottom tape for pressed carrier tape

◦Punched carrier tape（4mm pitch）

◦Paper tape

㧗0.1/−0

Unit：mm

Chip Cavity

Type

Insertion Pitch

F

Tape Thickness

T

A

B

□MK107

□WK107

□2K110

1.0

1.15

1.8

1.1max.

1.0max.

◦Embossed tape

1.55

□MK212

□WK212

□4K212

□2K212

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

□MK316

◦Chip ﬁlled

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_pack_e-01

mlcc_pack-P1

■ PACKAGING

◦Embossed tape（4mm wide）

④Trailer and Leader

0.8±0.04

0.9±0.05

100mm or more

Trailer 160mm min.

Leader 400mm min.

1.0±0.02

2.0±0.04

Ｆ

Unit：mm

Tape Thickness

⑤Reel size

Chip Cavity

Insertion Pitch

Type

□MK042

A

B

F

K

T

t

0.23

0.43

1.0±0.02

0.5max.

0.25max.

E

C

◦Embossed tape（8mm wide）

A

㧗0.1/−0

B

D

R

W

Unit：mm

A

B

C

φ178±2.0

φ50min.

φ13.0±0.2

Unit：mm

Tape Thickness

D

E

R

Chip Cavity

Type

Insertion Pitch

F

φ21.0±0.8

2.0±0.5

1.0

A

B

K

T

□WK107

□MK212

□MK316

□MK325

1.0

1.65

2.0

2.8

1.8

2.4

3.6

1.3max

0.25±0.1

t

W

4.0±0.1

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

3.4max.

0.6max.

◦Embossed tape（12mm wide）

⑥Top Tape Strength

㧗0.1/−0

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow

as illustrated below.

2.0±0.1

F

⑦Bulk Cassette

The exchange of individual speciﬁcation is necessary.

Please contact Taiyo Yuden sales channels.

Unit：mm

Tape Thickness

Chip Cavity

Type

Insertion Pitch

A

B

F

K

T

□MK432

3.7

4.9

8.0±0.1

4.0max.

0.6max.

12±0.1

36＋0/－0.2

110±0.7

2.0＋0/－0.1

1.5＋0.1/－0

1.0＋0/－0.1

Unit：mm

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_pack_e-01

mlcc_pack-P2

■ RELIABILITY DATA

Multilayer Ceramic Capacitors and Super Low Distortion Multilayer Ceramic

Capacitors are noted separately.

MediumーHigh Voltage Multilayer Ceramic Capacitor

1. Operating Temperature Range

Speciﬁed Value

X7R, X7S：－55～＋125℃ X5R：－55～＋85℃ B：－25～＋85℃

2. Storage Temperature Range

Speciﬁed Value

X7R, X7S：－55～＋125℃ X5R：－55～＋85℃ B：－25～＋85℃

100VDC, 250VDC, 630VDC

3. Rated Voltage

Speciﬁed Value

4. Withstanding Voltage（Between terminals）

Speciﬁed Value

No breakdown or damage

【Test Methods and Remarks】

Applied voltage:Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）

Duration：1 to 5sec.

Charge/discharge current：50mA max.

５．Insulation Resistance

Speciﬁed Value

100MΩμF or 10GΩ, whichever is smaller.

【Test Methods and Remarks】

Applied voltage:Rated voltage（HMK, QMK）, 500V（SMK）

Duration：60±5sec.

Charge/discharge current：50mA max.

6．Capacitance（Tolerance）

Speciﬁed Value

±10％、±20％

【Test Methods and Remarks】

Measuring frequency:1kHz±10%

Measuring voltage:1±0.2Vrms

Bias application:None

７．Dissipation Factor

3.5%ma（x HMK）

2.5%ma（x QMK, SMK）

Speciﬁed Value

【Test Methods and Remarks】

Measuring frequency:1kHz±10%

Measuring voltage:1±0.2Vrms

Bias application:None

8．Temperature Characteristic of Capacitance

Speciﬁed Value

B： ±10％（－25～＋85℃）

X5R：±15％（－55～＋85℃）

X7R：±15％（－55～＋125℃）

X7S：±22％（－55～＋125℃）

【Test Methods and Remarks】

Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.

（C－C₂）

Step

B

X5R、X7R、X7S

Minimum operating temperature

20℃ 25℃

Maximum operating temperature

×100（％）

ꢁC₂

1

2

3

C

：Capacitance value in Step 1 or Step 3

C₂：Capacitance value in Step 2

9．Deﬂection

Appearance:No abnormality

Capacitance change:Within±10%

Speciﬁed Value

【Test Methods and Remarks】

Warp:1mm

Duration:10sec.

R-230

Test board:glass epoxy-resin substrate

Thickness:1.6mm

Capacitance measurement shall be conducted with the board bent.

10．Adhesive Strength of Terminal Electrodes

Speciﬁed Value

No terminal separation or its indication.

【Test Methods and Remarks】

Applied force:5N

Duration:30±5sec.

ꢁꢁꢁ

11．Solderability

Speciﬁed Value

At least 95% of terminal electrode is covered by new solder

【Test Methods and Remarks】

Solder type

H60A or H63A

Lead-free solder Snー3.0Agー0.5Cu

Solder temperature

Duration

Eutectic solder

230±5℃

245±3℃

4±1 sec.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_reli_e-01

mlcc06_reli-R1

■ RELIABILITY DATA

12．Resistance to Soldering

Appearance:

No abnormality

Capacitance change:

Dissipation factor :

Insulation resistance:

Within±15%（HMK）, ±10%（QMK, SMK）

Initial value

Speciﬁed Value

Withstanding voltage（between terminals）: No abnormality

【Test Methods and Remarks】

Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1

Solder temperature:270±5℃

Duration:3±0.5sec.

Preheating conditions: 80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5min.

Recovery : 24±2hrs under the standard condition Note3

13．Temperature Cycle（Thermal Shock）

Appearance:

Capacitance change: Within±15%（HMK）, ±7.5%（QMK, SMK）

Dissipation factor: Initial value

No abnormality

Speciﬁed Value

Insulation resistance: Initial value

【Test Methods and Remarks】

Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1

＋0

Conditions for 1 cycle／ Step 1: Minimum operating temperature

℃ 30±3min.

－3

Step 2: Normal temperature

Step 3: Maximum operating temperature

Step 4: Normal temperature

2 to 3min.

＋0

－3

℃ 30±3min.

2 to 3min.

Number of cycles:5 times

Recovery : 24±2hrs under the standard condition Note3

14．Humidit（y Steady state）

Appearance:

No abnormality

Capacitance change: Within±15%

Speciﬁed Value

Dissipation factor :

7%ma（x HMK）, 5%ma（x QMK, SMK）.

Insulation resistance: 25MΩμF or 1000MΩ, whichever is smaller.

【Test Methods and Remarks】

Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1

Temperature:40±2℃

Humidity：90 to 95%RH

＋24

Duration: 500

hrs

－0

Recovery : 24±2hrs under the standard condition Note3

15．Humidity Loading

Appearance:

No abnormality

Capacitance change: Within±15%

Speciﬁed Value

Dissipation factor:

7%ma（x HMK）, 5%ma（x QMK, SMK）.

Insulation resistance: 10MΩμF or 500MΩ, whichever is smaller.

【Test Methods and Remarks】

According to JIS 5102 clause 9.9.

Preconditioning:Voltage treatment Note2

Temperature:40±2℃

Humidity：90 to 95%RH

Applied voltage:Rated voltage

Charge/discharge current：50mA max.

＋24

Duration: 500

hrs

－0

Recovery : 24±2hrs under the standard condition Note3

16．High Temperature Loading

Appearance:

No abnormality

Capacitance change: Within±15%

Speciﬁed Value

Dissipation factor:

7%ma（x HMK）, 5%ma（x QMK, SMK）.

Insulation resistance: 50MΩμF or 1000MΩ, whichever is smaller.

【Test Methods and Remarks】

According to JIS 5102 clause 9.10.

Preconditioning:Voltage treatment Note2

Temperature:125±3℃（B7, C7）, 85±2℃（BJ）

Applied voltage:Rated voltage×2（HMK）

Rated voltage×1.5（QMK）

Rated voltage×1.2（SMK）

Charge/discharge current：50mA max.

＋24

Duration: 1000

hrs

－0

Recovery : 24±2hrs under the standard condition Note3

Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours.

Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage speciﬁed in the test conditions, and

kept at room temperature for 24±2hours.

Note3 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa

When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-

tion.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa

Unless otherwise speciﬁed, all the tests are conducted under the "standard condition".

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc06_reli_e-01

mlcc06_reli-R2

■ PRECAUTIONS

Precautions on the use of Multilayer Ceramic Capacitors

1. Circuit Design

◆Veriﬁcation of operating environment, electrical rating and performance

1.A malfunction of equipment in ﬁelds such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramiﬁcations.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-

pose applications.

◆Operating Voltage（Veriﬁcation of Rated voltage）

1.The operating voltage for capacitors must always be their rated voltage or less.

Precautions

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage

having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern conﬁgurations（Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used（size of ﬁllet）can directly affect the capacitor performance. Therefore, the following items must

be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper

amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.

◆Pattern conﬁguration（s Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting, board inspection,

mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern conﬁgurations and positions of capacitors

shall be carefully considered to minimize stresses.

◆Pattern conﬁgurations（Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）

ꢁWave-soldering

Land patterns for PCBs

Chip capacitor

Land

Type 107

212

2.0

316

3.2

1.6

325

3.2

2.5

L

1.6

0.8

Solder-resist

Size

W

51.25

A

0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5

0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7

0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5

C

B

C

B

A

Reﬂow-soldering

Type 042

063

0.6

0.3

105

1.0

0.5

107

1.6

0.8

212

2.0

316

3.2

1.6

325

3.2

2.5

432

4.5

3.2

Chip capacitor

L

0.4

0.2

Size

W

51.25

W

A

0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5

0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8

0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5

B

C

L

●LWDC: Recommended land dimensions for reﬂow-soldering（unit: mm）

LWDC

Type

105

0.52

107

50.8

212

1.25

L

Size

W

1.0

1.6

2.0

W

A

0.18 to 0.22

0.2 to 0.25

0.9 to 1.1

0.25 to 0.3

0.3 to 0.4

1.5 to 1.7

0.5 to 0.7

0.4 to 0.5

1.9 to 2.1

B

C

L

Technical

consider-

ations

●Array type: Recommended land dimensions for reﬂow-soldering（unit: mm）

Type 096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）

2 circuits

4 circuits

Chip capacitor

L

0.9

1.37

2.0

c

Size

W

0.6

1.0

1.25

a

b

a

b

a

0.25 to 0.35

0.15 to 0.25

0.45

0.35 to 0.45

0.55 to 0.65

0.3 to 0.4

0.64

0.5 to 0.6

1.0

0.5 to 0.6

0.2 to 0.3

0.5

b

c

d

Land

（2）Examples of good and bad solder application

Items

Not recommended

Recommended

Mixed mounting of

SMD and leaded

components

Component

placement close to

the chassis

Hand-soldering

of leaded

components

near mounted

components

Horizontal

component

placement

To next page

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_prec_e-01

mlcc_prec-P1

■ PRECAUTIONS

Precautions on the use of Multilayer Ceramic Capacitors

2. PCB Design

◆Pattern conﬁguration（s Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-

ﬂection.

Items

Not recommended

Recommended

Deﬂection of board

Technical

consider-

ations

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from

least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.

3. Mounting

◆Adjustment of mounting machine

1.When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2.Maintenance and inspection of mounting machines shall be conducted periodically.

Precautions ◆Selection of Adhesives

1.When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-

priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further

information.

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points

shall be considerable.

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deﬂection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

（3）To reduce the amount of deﬂection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the

PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:

Items

Not recommended

Recommended

Single-sided

mounting

Double-sided

mounting

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted

periodically.

Technical

consider-

ations

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-

tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions

shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufﬁcient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f . The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Figure

212/316 case sizes as examples

a

b

c

0.3mm min

100 to 120μm

Adhesives shall not contact land

ꢁꢁ

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_prec_e-01

mlcc_prec-P2

■ PRECAUTIONS

Precautions on the use of Multilayer Ceramic Capacitors

4. Soldering

◆Selection of Flux

Since ﬂux may have a signiﬁcant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（in CI equivalent）of halogenated content. Flux having a strong acidity content shall not be applied.

（2）When shall capacitors are soldered on boards, the amount of ﬂux applied shall be controlled at the optimum level.

（3）When water-soluble ﬂux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate ﬂux, or highly acidic ﬂux is used, it may lead to corrosion of terminal elec-

trodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much ﬂux is applied, a large amount of ﬂux gas may be emitted and may adversely affect

the solderability. To minimize the amount of ﬂux applied, it is recommended to use a ﬂux-bubbling system.

1-3. Since the residue of water-soluble ﬂux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause

a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be

considered carefully when water-soluble ﬂux is used.

◆Soldering

• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.

• Preheating : Capacitors shall be preheated sufﬁciently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.

• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

［Reﬂow soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

300

Peak 260℃ Max.

Within 10sec.

Preheating

230℃

Within 10 sec.

60sec. 60sec.

200

100

0

Slow

cooling

Min.

Slow cooling

100

Heating above

Preheating 150℃

230℃

Capacitor

PC board

60sec. Min.

40sec. Max.

0

Solder

T

Caution

①The ideal condition is to have solder mass（ﬁllet）controlled to 1/2 to 1/3 of the thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as

close to recommended times as possible.

Technical

consider-

ations

［Wave soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

300

Peak 260℃ Max.

230～250℃

Within 10sec.

Within 3sec.

Preheating

120sec. Min.

200

120sec. Min.

200

Slow

cooling

Slow cooling

Preheating

150℃

100

0

Caution

①Wave soldering must not be applied to capacitors designated as for reﬂow soldering only.

［Hand soldering］

【Recommended conditions for eutectic soldering】

【Recommended condition for Pb-free soldering】

400

300

200

100

0

400

300

200

100

0

Peak 350℃ Max.

Peak 280℃ Max.

230～280℃

Within 3 sec.

300

Within 3sec.

⊿T

Slow cooling

⊿T

200

Slow cooling

Preheating

150℃ Min.

Preheating

150℃ Min.

100

Preheating

60sec. Min.

0

⊿T

⊿T≦150℃

⊿T

⊿T≦130℃

316type or less

325type or more

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_prec_e-01

mlcc_prec-P3

■ PRECAUTIONS

Precautions on the use of Multilayer Ceramic Capacitors

5. Cleaning

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning（. e.g. to

Precautions

remove soldering ﬂux or other materials from the production process.）

2. Cleaning condition shall be determined after it is veriﬁed by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as ﬂux residue to adhere to capacitors or deteriorate their outer coating, resulting in

a degradation of the capacitor's electrical properties（especially insulation resistance）.

2. Inappropriate cleaning conditions（insufﬁcient or excessive cleaning）may adversely affect the performance of the capacitors.

Technical

consider-

ations

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered

portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;

Ultrasonic output : 20 W/ℓor less

Ultrasonic frequency : 40 kHz or less

Ultrasonic washing period : 5 min. or less

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-

age conditions resulting in the deterioration of the capacitor's performance.

Precautions

7. Handling

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or

destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deﬂection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

Precautions

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a ﬂoor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.

8. Storage conditions

◆Storage

1.To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in

the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature

Humidity

: Below 30℃

: Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-

tors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2.The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time,ｓo care shall be taken to design circuits . Even if

capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.

Technical If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/

consider- packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-

ations

fore using the capacitors.

※RCR-2335B（Safety Application Guide for ﬁxed ceramic capacitors for use in electronic equipment）is published by JEITA.

ꢁPlease check the guide regarding precautions for deﬂection test, soldering by spot heat, and so on.

＊This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_prec_e-01

mlcc_prec-P4


型号：	HMK325B7684KN
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.68uF, 1210,
文件：	总15页 (文件大小：503K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HMK325B7684KN [TAIYO YUDEN]

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